NXP Mifare s50 RFID standard inlays (Large rectangle, chip:compatibled FUDAN FM11RF08) - N07504521H

1.Use Flip-chip assembly process., 2.Ideal for asset management in library and media management applications . - more info check here: //www.packaginghere.com/product/nxp-mifare-s50-rfid-standard-inlays-large-rectangle-chip-compatibled-fudan-fm11rf08-11293094.html

Quick Brief

Material: Inlay substrate material: PET Usage: Custom Sticker Type: RFID Feature: Anti-Counterfeit Custom Order: Accept Place of Origin: Guangxi China (Mainland) Brand Name: XGS Model Number: N07504521H White: Transparent.

Product Features:

1.Use Flip-chip assembly process.

2.Ideal for asset management in library and media management applications .

Business Terms:

Minimum Order Quantity: 50000 Piece/Pieces

Supply Ability: 3,000,000 Piece/Pieces per Month

Payment Terms: T/T,Western Union

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NXP Mifare s50 RFID standard inlays (Large rectangle, chip:compatibled FUDAN FM11RF08)

Specifications and Product Details:

RF Features

1.Operating Frequency: 13.56MHz

2.Mode of operation: Passive (no battery needed)

Electrical Characteristics

1.Protocol: ISO/IEC 14443TypeA

2.Chip: FUDAN FM11RF08

(Compatible with NXP Mifare s50, made in China)

Inlay material

1.Substrate material: PET

2.Antenna material: AL

3.HF IC: Silicon,150μm±10μm

Inlay Specification(Single Line)

1.Antenna size(CD×MD): 45×75mm

2.Standard pitch(MD): 88.4mm

3.Slit edge: 5.7mm

4.Max units per roll: 5,000 pcs

Environmental Specification

1.Shelf life; 5 Years

2.Recommended Storage Condition; -25°C to +50°C, 20% to 90%RH

3.Operating Temp: -40°C to +65°C

Applications
This product should be tested by the customer/user thoroughly under end use conditions to ensure the product is fit for any particular purpose or use.