1.Use Flip-chip assembly process.
2.Ideal for asset management in library and media management.
3.ISO/IEC 15693 compliance
Minimum Order Quantity: 50000 Piece/Pieces
Supply Ability: 3,000,000 Piece/Pieces per Month
Payment Terms: T/T,Western Union
Contact Supplier
Packaging Detail: Roll or According to Customers' Requirement.
Delivery Detail: 7-12 Working Days after Payment.
Applications
Product Authentication
Library
Supply-Chain Management
Asset Management
Ticketing/Stored Value
RF Features
1.Operating Frequency: 13.56MHz
2.Mode of operation: Passive (battery free)
Electrical Characteristics
1.RF Communications Protocol: ISO/IEC 15693
2.Chip-Manufacturer & IC Name: NXP ICODE SLI
Inlay material
1.Substrate material: PET
2.Antenna material: AL
3.HF IC: Silicon,150μm±10μm
Inlay Specification(Single Line)
1.Antenna size(CD×MD): 46×78mm
2.Standard pitch(MD): 88mm
3.Slit edge: 4mm
4.Max units per roll: 5,000 pcs
Environmental Specification
1.Shelf life: 5 Years
2.Recommended Storage Condition: -25°C to +50°C, 20% to 90%RH
3.Operating Temp: -40°C to +65°C
Applications
This product should be tested by the customer/user thoroughly under end use conditions to ensure the product is fit for any particular purpose or use.
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