K&S 4124 Gold Ball Bonder

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Condition: Used Year: 2009

Product Features:

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Minimum Order Quantity: 1 Unit/Units

Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram

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Specifications and Product Details:

Process Description:
Once a die chip has been attached to a package, wire bonding is one method of making the
connection between the die and the package. Gold as a bonding wire is a room-temperature
conductor, a heat conductor and resistant to oxidation and corrosion. Gold wire bonding has two
basic methods: thermocompression and thermosonic. Basically, the gold wire is fed through a
capillary; an electrical spark melts the tip to form a ball; and then the capillary moves downward
to touch the bonding pad. After pressure, the capillary moves upward release some wire and then
positioned to make the second bond.

Equipment Description:
The K&S Model 4124 Ball Bonder is a thermosonic unit. The bonding is done at a lower
temperature with additional ultrasonic energy. The 4124 operates in two modes, a semi-
automatic and manual movement of the bonding head. The unit has a 1-mil gold wire installed
and is capable of a 152mm x 152mm bonding area.