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Minimum Order Quantity: 1 Unit/Units
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K & S 4123 Universal Wedge Bonder for Gold or Aluminum Wire
B&L SZ Microscope
Vacumm Heated Stage/workholder
K&S Universal Wedge Bonder. An aluminum or gold wire bonder versatile enough to bond simple ICs and discrete devices or complex hybrids with height variations up to 200 mils. With spotlight target option. Wire Diameter Range: Gold 0.5 to 3.0 mil., Aluminum 1.0 to 3.0 mil. 120V, 60 Hz.